MT53B384M32D2NP-062 WT

Orderable parts

MT53B384M32D2NP-062 WT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR4-3200
  • Density
    12Gb
  • FBGA Code
    D9VDT
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200-Ball Z0AM Embedded LPDDR4 SDRAM

MT53B384M32D2, MT53B768M32D4
  • File Type: PDF
  • Updated: 2018-07-18

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2019

Simulation Models

Z0AM IBIS

Z0AM Mobile LPDDR4 SDRAM, Die Rev. B, Partial PNs: MT53B384M32D2NP-062 AAT:B, MT53B384M32D2NP-062 AIT:B, MT53B384M32D2NP-062 AUT:B, MT53B768M32D4NQ-062 AIT:B
  • File Type: ZIP
  • Updated: 2019-01-07

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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