MT53B256M32D1NP-062 AUT

Orderable parts


Data Sheets

200-Ball Z91M Automotive LPDDR4 SDRAM

MT53B256M32D1, MT53B512M32D2
  • File Type: PDF
  • Updated: 2018-05-09T05:00:00.0000000Z

Production Data Sheet: 200-Ball Z01M LPDDR4 SDRAM Automotive

MT53B256M32D1NP-062 AAT:C, MT53B256M32D1NP-062 AIT:C, MT53B256M32D1NP-062 AUT:C, MT53B512M32D2NP-062 AAT:C, MT53B512M32D2NP-062 AIT:C, MT53B512M32D2NP-062 AUT:C
  • File Type: PDF
  • Updated: 2018-05-07T05:00:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models


Z01M Mobile LPDDR4 SDRAM, Die Rev. C
  • File Type: ZIP
  • Updated: 2017-03-15T05:00:00.0000000Z


Z01M Mobile LPDDR4 SDRAM, Die Rev. C, SDP, DDP, QDP, 200b, 272b, 366b, 432b
  • File Type: ZIP
  • Updated: 2018-09-19T05:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z