MT52L256M32D1PF-107 WT

Orderable parts

MT52L256M32D1PF-107 WT:B

Specs

  • Chipset Validation
  • Cycle Time
    1.071ns
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    D9SRZ
  • Op. Temp.
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x32

Data Sheets

Production Data Sheet: V01M 178-Ball Single-Channel Mobile LPDDR3 SDRAM

SDP, DDP, QDP,11x11.5, MT52L256M32D1PF-093/107/125 WT:B                                    MT52L512M32D2PF-093/107/125 WT:B,MT52L512M32D2PF-093/107/125 WT:B
  • File Type: PDF
  • Updated: 4/15/2016

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

Verilog: 8Gb Mobile LPDDR3 V01M

Verilog simulation model for 8Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 12/25/2017

HSPICE: V01M Mobile LPDDR3 WT

HSPICE for V01M WT
  • File Type: ZIP
  • Updated: 3/24/2017

IBIS: V01M Die 168-Ball / 178-Ball / 256-Ball / 253-Ball /216-Ball / SDP_DDP_TDP_QDP_8DP Mobile LPDDR3 SDRAM

Rev 1.5_XT/WT, Rev 1.2_IT, Die, 168-Ball, 178-Ball, 256-Ball, 253-Ball, 216-Ball, SDP, DDP, TDP, QDP, 8DP, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 4/25/2018

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 3/23/2011

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
+