MT46H32M32LFCM-6 IT

Contact Sales

Orderable parts

MT46H32M32LFCM-6 IT:A

Specs

Ball Count

90-ball
Chipset Validation

N/A
Cycle Time

6ns
Density

1Gb
FBGA Code

D9HSJ
Op. Temp.

-40C to +85C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Technology

LPDDR
Width

x32

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.

File Type: PDF
Updated: 2014-12-18

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TN-46-12: Mobile DRAM Power-Saving Features and Calculations

This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.

File Type: PDF
Updated: 2009-05-16

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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