EDFP164A3PD-JD-F

Orderable parts

EDFP164A3PD-JD-F-D
EDFP164A3PD-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    24Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64

Data Sheets

Production Data Sheet: V9AM 24Gb: 256-Ball, 4 x 6Gb, Dual-Channel Mobile LPDDR3

EDFP164A3PD-GD-F-D, EDFP164A3PD-GD-F-R, EDFP164A3PD-JD-F-D, EDFP164A3PD-JD-F-R
  • File Type: PDF
  • Updated: 2016-03-24

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2019

Simulation Models

IBIS: 256-Ball V9AM QDP Mobile LPDDR3 SDRAM

Rev 1.0 256-Ball, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-08-31

Verilog: 6Gb Mobile LPDDR3 V9AM

Verilog simulation model for 6Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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