EDF8164A3PF-JD-F

Orderable parts

EDF8164A3PF-JD-F-D
EDF8164A3PF-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Technology
    LPDDR3
  • Width
    x64

Data Sheets

Production Data Sheet: 8Gb, 16Gb: 256-Ball, Dual-Channel 2E0F Mobile LPDDR3 SDRAM

256-Ball, DDP, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 2014-10-26

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2019

Simulation Models

IBIS: 256-Ball 2E0F Mobile LPDDR3 SDRAM

Rev 1.0 256-Ball, DDP, Single-Channel, LPDDR3 SDRAM
  • File Type: ZIP
  • Updated: 2014-09-02

Verilog: 4Gb Mobile LPDDR3 2E0F

Verilog simulation model for 4Gb Mobile LPDDR3
  • File Type: ZIP
  • Updated: 2018-01-23

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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