EDB5432BEBH-1DAAT-F

Orderable parts

EDB5432BEBH-1DAAT-F-D
EDB5432BEBH-1DAAT-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    512Mb
  • FBGA Code
    D9WZN
  • Op. Temp.
  • Part Status
    Production
  • PLP
    Yes
  • PLP Start Date
    4/1/2014
  • Technology
    LPDDR2
  • Width
    x32
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    512Mb
  • FBGA Code
    D9WZP
  • Op. Temp.
  • Part Status
    Production
  • PLP
    Yes
  • PLP Start Date
    4/1/2014
  • Technology
    LPDDR2
  • Width
    x32

Data Sheets

512Mb: x32 Automotive LPDDR2 SDRAM

U97M: Automotive LPDDR2 SDRAM, EDB5432BEBH, EDB5432BEPA
  • File Type: PDF
  • Updated: 2018-05-15T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

IBIS: U97M Mobile LPDDR2 SDRAM

Rev 1.1, LPDDR2 SDRAM, AUT, AAT, IT
  • File Type: ZIP
  • Updated: 2018-10-12T05:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15T00:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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