Orderable parts


Data Sheets

Production Data Sheet: 168-ball 2C0E Mobile LPDDR2 SDRAM

168-ball FBGA, 4Gb, PoP, 12mm x 12mm
  • File Type: PDF
  • Updated: 2014-02-26

Simulation Models

IBIS: 168-Ball 2C0E SDP Mobile LPDDR2 SDRAM

Rev 1.0
  • File Type: ZIP
  • Updated: 2014-02-28

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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