EDB4064B4PB-1D-F

Orderable parts

EDB4064B4PB-1D-F-D
EDB4064B4PB-1D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
    1.875ns
  • Data Rate
    LPDDR2-1066
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64

Data Sheets

1Gbit, 2Gbit, 4Gbit U98M Embedded LPDDR2 SDRAM Data Sheet

EDB1316BD (1Gb/2KB - single die, x16), EDB1332BD (1Gb/2KB - single die, x32), EDB2432B4 (2Gb/2KB - dual die, x32), EDB4064B4 (4Gb/2KB - quad die, x64)
  • File Type: PDF
  • Updated: 2016-11-17

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2020

Simulation Models

HSPICE: U98M Mobile LPDDR2 SDRAM

HSPICE for U98M AT, IT, UT, WT
  • File Type: ZIP
  • Updated: 2016-06-20

IBIS: U98M Mobile LPDDR2 SDRAM

Rev 1.1; Temp ranges supported= AT, IT, UT, WT, XT
  • File Type: ZIP
  • Updated: 2016-06-12

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27
See All
+