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DRAM components

DDR5 DRAM

Optimal memory performance and capacity for Intel® Xeon® 6 processors

Micron MRDIMM provides the highest-bandwidth, lowest-latency and highest-capacity main memory for accelerating memory-intensive workloads like AI and High-Performance Computing environments using Intel Xeon 6 processors. ​

Available from 32GB up to 256GB, our high-capacity MRDIMMs are ready to be deployed in data center environments. Micron’s high-performance MRDIMM solution delivers up to a 39% improvement in bandwidth with energy efficiency.

DDR5 MRDIMM group shot

Industry's first scalable memory

Micron delivers higher performance DRAM that:

  • Scaled overall bandwidth with DDR5 RDIMM speeds up to 9200 MT/s and MRDIMM up to 8800 MT/s​
  • Delivers up to a 2x improvement in memory bandwidth compared to DDR4 SDRAM at 3200 MT/s​
  • Brings new and increased capacities with 32Gb monolithic die based 128GB RDIMMs​
Micron DDR5 MRDIMM

Fueling AI advances with Micron 96GB and 128GB high-capacity RDIMMs

Micron’s world-class high-capacity RDIMM modules are fueling advances in AI data centers around the world. Powered by Micron’s industry-leading 1β (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density,4 up to 22% improved energy efficiency5 and up to 16% lower latency4 over competitive 3DS through-silicon via (TSV) products. 

Micron DDR5 RDIMM 96GB and 128GB modules side by side

Pioneering memory technology advancements for future compute needs

Micron today announced it is the first in the industry to sample its 1γ (1-gamma) DRAM node in DDR5 memory to select data center customers, client customers and ecosystem enablers.

DDR5 RDIMM component

Micron DDR5 SDRAM: Scalable memory for growing processor core counts

Fueling performance for modern workloads by delivering the memory bandwidth needed to turn large data sets into insight — quickly and efficiently.

Mixed race technician using digital tablet in server room

Technology Enablement Program for DDR5

The Technology Enablement Program (TEP) for DDR5 offers a path into Micron to gain early access to technical information and support, electrical and thermal models, as well as memory products to aid in the design, development and introduction of next-generation computing platforms.

Abstract neon lights into digital technology tunnel. Futuristic technology abstract background with lines for network, big data, data center, server, internet, speed. 3D rende

The advantages of DDR5


Details


Micron DDR5: The memory technology for next-generation Intel server platforms

Intel has announced the latest generation of servers featuring 4th Gen Intel® Xeon® Scalable processors. Micron DDR5 runs SPECjbb 48% faster on the Dell PowerEdge 760 platform compared to previous generations.3

Dark server room data center storage 3D rendering

Advantages of migrating to DDR5

DDR5 is the next evolution in DRAM, bringing a robust list of new features geared to increase reliability, availability and serviceability (RAS); reduce power; and dramatically improve performance. See below for a list of some of the key feature differences between DDR4 and DDR5.

 

Feature/OptionDDR4DDR5DDR5 Advantage 
Data rates 600-3200MT/s4800-8800MT/s Increases performance and bandwidth 
VDD/VDDQ/VPP 1.2/1.2/2.5  1.1/1.1/1.8Lowers power 
Internal VREFVREFDQVREFDQ, VREFCA, VREFCSImproves voltage margins, reduces BOM costs 
Device densities 2Gb-16Gb 16Gb, 24Gb, 32GbEnables larger monolithic devices 
Prefetch 8n16nKeeps the internal core clock low 
DQ receiver equalizationCTLEDFEImproves opening of the received DQ data eyes inside the DRAM 
Duty cycle adjustment (DCA)NoneDQ and DQSImproves signaling on the transmitted DQ/DQS pins 
Internal DQS delay monitoring
None DQS interval oscillator Increases robustness against environmental changes 
On-die ECCNone128b+8b SEC, error check and scrubStrengthens on-chip RAS 
CRCWriteRead/WriteStrengthens system RAS by protecting read data 
Bank groups (BG)/banks 
4 BG x 4 banks (x4/x8)
2 BG x 4 banks (x16)
8 BG x 4 banks (16-64Gb x4/x8)
4 BG x 4 banks (16-64Gb x16)
Improves bandwidth/performance 
Command/address interfaceODT, CKE, ACT, RAS, CAS, WE, A<X:0> CA<13:0>Dramatically reduces the CA pin count 
ODTDQ, DQS, DM/DBIDQ, DQS, DM, CA bus Improves signal integrity, reduces BOM costs 
Burst lengthBL8 (and BC4)BL16 (and BC8 OTF)Allows 64B cache line fetch with only 1 DIMM subchannel. 
MIR (“mirror” pin)NoneYes Improves DIMM signaling 
Bus inversion Data bus inversion (DBI)Command/address inversion (CAI)Reduces VDDQ noise 
CA training, CS trainingNoneCA training, CS trainingImproves timing margin on CA and CS pins 
Write leveling training modesYesImprovedCompensates for unmatched DQ-DQS path 
Read training patternsPossible with the MPRDedicated MRs for serial (user defined), clock and LFSR -generated training patternsMakes read timing margin more robust 
Mode registers7 x 17 bitsUp to 256 x 8 bits (LPDDR type read/write) Provides room to expand 
PRECHARGE commandsAll bank and per bankAll bank, per bank, and same bankPREsb enables precharging a bank in each BG 
REFRESH commands All bankAll bank and same bankREFsb enables refreshing a bank in each BG 
Loopback modeNoneYesEnables testing of the DQ and DQS signaling  

Micron's DDR5 ecosystem partners

Micron works closely with selected ecosystem partners to provide early access to next-generation storage and memory protocols. Learn how:

1.  Micron partners with AMD to deliver next-generation data center performance.

2.  Micron partners with Intel to deliver next-generation server platforms.

Featured resources

Frequently asked questions

DDR5 RAM is fifth-generation double data rate (DDR) random-access memory (RAM) technology. RAM is the general term people use to describe system memory, but all DDR5 memory is based on dynamic random access memory (DRAM) technology. DRAM stores data in memory cells made up of a capacitor and a transistor and is designed for fast data access while a system is running. “DDR” refers to the ability to transfer data on both the rising and falling edges of the clock signal, increasing data throughput. 

No, DDR5 memory and DDR4 motherboards are physically and electrically incompatible. DDR5 RAM will only fit in DDR5 motherboards, and DDR4 RAM will only fit in DDR4 motherboards.

Both! Micron uses the megatransfers per second (MT/s) unit when referring to the transfer rate of the memory. The use of megahertz (MHz) is appropriate when talking about the actual clock speed of the memory. Because all DDR memory technology, including DDR5 RAM, is “double data rate,” transfers occur on both the rise and fall of the clock signal edge.

In short, they all generally mean the same thing. RAM (Random Access Memory) is the broad term for a computer’s main working memory. DRAM (Dynamic RAM, pronounced dee-ram) is the most common type of RAM used in personal computers and servers. SDRAM (Synchronous DRAM) refers to a timing innovation first widely commercialized in the 1990s, which has become ubiquitous across all DRAM. SDRAM operates in sync with the system clock for faster, more efficient performance.
 

DDR5 memory is DDR5 SDRAM. While memory is commonly referred to as “DRAM” or simply “RAM,” all modern server memory sold by Micron is advanced SDRAM technology designed for high performance and reliability.

DDR5 RAM offers several key improvements over DDR4, especially for modern, data intensive workloads. DDR5 provides higher bandwidth and faster data transfer rates, enabling better performance for applications such as AI, machine learning, advanced analytics, and high performance computing. It also introduces greater memory capacity per module, allowing systems to scale more efficiently.
 

In addition, DDR5 is designed with improved power efficiency, using on module power management to deliver more consistent performance while reducing overall energy consumption. Enhanced features like dual independent channels per DIMM also improve data handling and multitasking compared to DDR4.
 

For more information and an overview of the differences, see our side-by-side assessment of DDR5 vs. DDR4.

Yes, as data centers move to support the more complex algorithms used for AI training, DDR5 server RAM is superior to DDR4 in the following ways:
 

  • Micron DDR5 server DRAM nearly doubles the performance of DDR4. Unlike DDR4, DDR5 is optimized to increase server and workstation performance by 85% or more. First introduced in 2014, DDR4 can no longer keep up with the demands of the data center. With more instances of actively running virtual machines on a single platform, DDR5 technology relieves the bandwidth-per-core memory crunch and increases the performance and responsiveness of virtualized applications.
  • Micron builds DDR5 server memory with power management integrated circuits (PMICs) on the module. This design can initially mean a lower overall cost to power DDR5 servers when some system slots are left open.
  • Micron DDR5 server memory delivers higher bandwidth and improved reliability, availability, and scaling versus DDR4. It is 100% component- and module-tested to mission-critical server standards and optimized for current and future Intel® and AMD® DDR5 server and workstation platforms. As one of three major memory manufacturers, Micron tests and validates our DDR5 server memory to work with all major DDR5 server platforms.

DDR5 memory operates at a voltage of 1.1 volts, compared to 1.2 volts for DDR4, offering a meaningful reduction in power consumption per bit when used at scale.

Micron works closely with industry leaders in CPU and platform development and with leading system and motherboard manufacturers to enable the next level of memory technology. Micron is a proven industry leader with the experience and expertise to engineer quality memory products for servers  from start to finish. 

1.  STREAM benchmark testing: Single socket 3rd Gen AMD EPYC CPU 7763 (64 cores) with Micron DDR4 3200 MHz system is capable of 189 GB/sec; single socket 4th Gen AMD EPYC CPU 9654 (96 cores) with Micron DDR5 4800 MHz system is capable of 378 GB/sec; this result is based on testing at Micron Austin Labs.
2.  Currently sampling to ecosystem partners.
3.  https://www.dell.com/en-us/blog/leading-sap-hana-performance-by-dell-poweredge-r760-servers/
4. Based on competitive data sheets and JEDEC specifications.
5. Micron 5,600 MT/s 128GB DDR5 RDIMM memory compared to SK Hynix’s 5,600 MT/s 3DS TSV product yields 22.2% better power efficiency. 

 

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