MT40A8G4VNE-062H

Orderable parts

MT40A8G4VNE-062H:B

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9XQC
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Simulation Models

32Gb/64Gb DDR4 MS IBIS: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-11-13

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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