MT40A8G4CLU-062H

Orderable parts

MT40A8G4CLU-062H:E

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9WFQ
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x4

Data Sheets

16Gb, 32Gb: x4, x8 3DS DDR4 SDRAM

16Gb, 32Gb: x4, x8 3DS DDR4 SDRAM
  • File Type: PDF
  • Updated: 7/20/2017

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 6/27/2018

IBIS: Z11B MS

Rev. 2.0 (Die Rev. E)
  • File Type: ZIP
  • Updated: 9/14/2018

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 8/29/2018

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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