MT40A512M8HX-083E

Orderable parts

Specs

Data Sheets

4Gb: x4, x8, x16 DDR4 SDRAM

4Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2019-08-08

Simulation Models

HSpice

2.1 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2014-09-08

IBIS: 4Gb DDR4 SDRAM Z80A

Model Revision 2.7 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2016-08-19

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-40-03: Using DDR4 in Networking Subsystems

This technical note focuses on using DDR4 in networking subsystems. It highlights the main benefits of DDR4 devices, as well as some of the constraints, to help system designers maximize the performance of their memory subsystems.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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