MT40A512M16LY-075E

Orderable parts

Specs

Simulation Models

8Gb DDR4 Automotive HSPICE: Z11B

Rev. 2.7 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2019-07-02

8Gb DDR4 HSPICE: Z11B

Rev. 2.7 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2019-07-02

8Gb DDR4 Automotive IBIS: Z11B

Rev. 2.6 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2019-08-23

8Gb DDR4 IBIS: Z11B

Rev. 2.6 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2019-08-23

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2018-08-20
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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