MT40A512M16JY-083E AIT

Orderable parts

MT40A512M16JY-083E AIT:B

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9VFN
  • Op. Temp.
    -40C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

8Gb: x8, x16 Automotive DDR4 SDRAM

MT40A1G8, MT40A512M16
  • File Type: PDF
  • Updated: 2023-05-25

4Gb: x8, x16 Automotive DDR4 SDRAM

MT40A512M8, MT40A256M16
  • File Type: PDF
  • Updated: 2021-03-30

Simulation Models

8Gb DDR4 Automotive HSPICE: Z01A

Rev. 2.3 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2018-02-07

8Gb DDR4 Automotive IBIS: Z01A

Rev. 2.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2018-02-07

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2023-03-14

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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