MT40A512M16AD-062E AUT

Orderable parts

MT40A512M16AD-062E AUT:E

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D8BVM
  • Op. Temp.
    -40C to +125C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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