MT40A4G8BAF-062E

Orderable parts

MT40A4G8BAF-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9XQM
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 2019-07-31

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2018-08-20
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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