MT40A4G4VA-062E

Orderable parts

MT40A4G4VA-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D9XPD
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

16Gb: x4, x8, x16 DDR4 SDRAM

16Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2021-08-19

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

16Gb DDR4 Automotive HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 Automotive IBIS: Z22A

Rev. 2.4.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2021-05-19

16Gb DDR4 IBIS: Z22A

Rev. 2.4 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2021-05-07

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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