MT40A4G4FSE-083E

Orderable parts

MT40A4G4FSE-083E:A

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D9SRN
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

16Gb: x4, x8 1.2V TwinDie DDR4 SDRAM

16Gb: x4, x8 1.2V TwinDie DDR4 SDRAM Data Sheet
  • File Type: PDF
  • Updated: 2021-10-25

Simulation Models

HSPICE

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2017-05-24

IBIS

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2017-05-24

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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