MT40A4G4FSE-083E

Orderable parts

MT40A4G4FSE-083E:A

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D9SRN
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

16Gb: x4, x8 1.2V TwinDie DDR4 SDRAM

16Gb: x4, x8 1.2V TwinDie DDR4 SDRAM Data Sheet
  • File Type: PDF
  • Updated: 2019-10-09

Simulation Models

HSPICE

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2017-05-24

IBIS

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2017-05-24

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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