MT40A2G4SA-062E

Orderable parts

MT40A2G4SA-062E:E
MT40A2G4SA-062E:J
MT40A2G4SA-062E:R

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9WFK
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4
  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9WSL
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4
  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D8BPH
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Simulation Models

HSPICE: Z41C

Rev. 2.3 (Die Rev. R)
  • File Type: ZIP
  • Updated: 2022-08-23

8Gb DDR4 IBIS: Z41C

Rev. 2.3 (Die Rev. R)
  • File Type: ZIP
  • Updated: 2022-09-01

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2023-03-14

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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