MT40A2G4SA-062E

Rev. 2.3 (Die Rev. R)

Rev. 2.3 (Die Rev. R)

System verilog models for DDR4 SDRAM

Adding ECC With DDR4 x16 Components

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

DDR4 Point-to-Point Design Guide

Explanation of Micron packaging labels and procedures.

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.