MT40A2G16TBB-062E

Orderable parts

MT40A2G16TBB-062E:F

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D8CKD
  • Op. Temp.
    0C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb: x4, x8, x16 DDR4 SDRAM

16Gb: x4, x8, x16 DDR4 SDRAM, MT40A4G4SA-062E
  • File Type: PDF
  • Updated: 2021-08-19

32Gb: x16, 1.2V TwinDie Single-Rank DDR4 SDRAM

32Gb: x16, 1.2V TwinDie Single-Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 2021-12-08

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2023

Simulation Models

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

32Gb x16 DDP DDR4 SPICE: Z42B

Rev 1.2 (Die Rev F)
  • File Type: ZIP
  • Updated: 2023-04-24

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2023-03-14

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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