MT40A1G8WE-083E AAT

Orderable parts

MT40A1G8WE-083E AAT:B

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9VGX
  • Op. Temp.
    -40C to +105C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4Gb: x8, x16 Automotive DDR4 SDRAM

MT40A512M8, MT40A256M16
  • File Type: PDF
  • Updated: 2021-03-30

8Gb: x8, x16 Automotive DDR4 SDRAM

MT40A1G8, MT40A512M16
  • File Type: PDF
  • Updated: 2020-10-02

Simulation Models

8Gb DDR4 Automotive HSPICE: Z01A

Rev. 2.3 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2018-02-07

8Gb DDR4 Automotive IBIS: Z01A

Rev. 2.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2018-02-07

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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