MT40A1G16RC-062E

Orderable parts

MT40A1G16RC-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D9XPG
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb: x4, x8, x16 DDR4 SDRAM

16Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2020-08-11

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2020

Simulation Models

16Gb DDR4 Automotive HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 Automotive IBIS: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 IBIS: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-09-08

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
See All
+