EDY4016AABG-JD-F

Orderable parts

EDY4016AABG-JD-F-D
EDY4016AABG-JD-F-R

Specs

  • Chipset Validation
    N/A
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16
  • Chipset Validation
    N/A
  • Density
    4Gb
  • FBGA Code
    N/A
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

4Gb: x16 DDR4 SDRAM

4Gb: x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 7/13/2017

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 6/27/2018

HSpice

1.0
  • File Type: ZIP
  • Updated: 1/15/2015

IBIS - 4Gb DDR4 x16

Revision 1.2
  • File Type: ZIP
  • Updated: 8/19/2015

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 8/29/2018

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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