MT41K64M16JT-15E

2.1 (Die Rev. G)

2.2 (Die Rev. G)

1.74

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life

Explanation of Micron packaging labels and procedures.

Describes design considerations for bare die SiPs and MCMs.