MT41K64M16JT-15E

Orderable parts

MT41K64M16JT-15E:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1333
  • Density
    1Gb
  • FBGA Code
    D9MPK
  • Features
  • Op. Temp.
    0C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR3L SDRAM

  • File Type: PDF
  • Updated: 2018-09-20

Simulation Models

HSpice

2.1 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-08

IBIS

2.2 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2014-12-02

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.
  • File Type: PDF
  • Updated: 2023-06-30

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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