MT41K512M8DA-107 AAT

Orderable parts

MT41K512M8DA-107 AAT:P

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    4Gb
  • FBGA Code
    D9SGX
  • Features
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

4Gb: x8, x16 Automotive DDR3L SDRAM

MT41K512M8: 64 Meg x 8 x 8 banks, MT41K256M16: 32 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2019-08-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2019

Simulation Models

HSpice

2.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2016-01-28

IBIS

2.0 (Die Rev.P)
  • File Type: ZIP
  • Updated: 2019-08-13

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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