MT41K512M16HA-107 AIT

Orderable parts


Data Sheets

8Gb: x8, x16 Automotive DDR3L SDRAM

MT41K1G8 – 128 Meg x 8 x 8 banks, MT41K512M16 – 64 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2019-10-30

Simulation Models


Rev 2.0
  • File Type: ZIP
  • Updated: 2015-03-06


Rev 2.3
  • File Type: ZIP
  • Updated: 2016-08-12

DDR3 SDRAM Verilog Model

  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-41-17: DDR3L MT41K512M16 SDP to DDP Migration Guide

This technical note explains how to migrate a PCB design that uses a Micron 8Gb DDR3L product from a 90 series single-die 96-ball package to a 100 series dual-die 96- ball package.
  • File Type: PDF
  • Updated: 2018-10-31
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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