MT41K256M16HA-125 XIT

Orderable parts

Specs

Data Sheets

4Gb: x4, x8, x16 DDR3L SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-03-20

Simulation Models

HSpice

2.4 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-05-10

IBIS

2.5 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2014-03-11

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

User's Manual: New Features of DDR3 SDRAM

This manual is intended for users who design application systems using DDR3 SDRAM manufactured by Elpida.
  • File Type: PDF
  • Updated: 2014-02-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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