MT41K1G8TRF-107

Orderable parts

MT41K1G8TRF-107:E

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    D9RPJ
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

8Gb: x4, x8 TwinDie DDR3L SDRAM

Rev. K
  • File Type: PDF
  • Updated: 2018-08-02

8Gb: x4, x8 TwinDie DDR3L SDRAM

Rev. F
  • File Type: PDF
  • Updated: 2013-05-07

Simulation Models

HSpice

2.0 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-06-04

IBIS

2.0 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-06-04

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

User's Manual: New Features of DDR3 SDRAM

This manual is intended for users who design application systems using DDR3 SDRAM manufactured by Elpida.
  • File Type: PDF
  • Updated: 2014-02-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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