MT41K128M8DA-107 AIT

Orderable parts

MT41K128M8DA-107 AIT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    1Gb
  • FBGA Code
    D9SGG
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    5/4/2011
  • Width
    x8

Data Sheets

1Gb: x8, x16 Automotive DDR3L SDRAM

MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-05-20

1Gb: x8, x16 Automotive DDR3L SDRAM Addendum (V88A)

MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-05-20

Simulation Models

HSpice

Version 2.3 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2016-09-12

IBIS

Version 2.1 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2018-08-30

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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