MT41K128M16JT-125 XIT

Orderable parts

MT41K128M16JT-125 XIT:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    2Gb
  • FBGA Code
    D9QTF
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    05/04/2011
  • Width
    x16

Data Sheets

2Gb: x4, x8, x16 Automotive DDR3L SDRAM Addendum

Product Longevity Program
  • File Type: PDF
  • Updated: 2014-03-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2020

Simulation Models

HSpice: 2Gb DDR3L SDRAM V89C

2.1 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2012-05-01

IBIS: 2Gb DDR3L SDRAM V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

User's Manual: New Features of DDR3 SDRAM

This manual is intended for users who design application systems using DDR3 SDRAM manufactured by Elpida.
  • File Type: PDF
  • Updated: 2014-02-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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