MT41K128M16JT-125 M AIT

Orderable parts

MT41K128M16JT-125 M AIT:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    2Gb
  • FBGA Code
    D9QXX
  • Features
    DDR3L-RS
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

2Gb: x8, x16 DDR3L-RS SDRAM

1.35V DDR3Lm SDRAM Addendum MT41K256M8, MT41K128M16
  • File Type: PDF
  • Updated: 2018-09-21

Simulation Models

HSpice: 2Gb DDR3L SDRAM Automotive V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

IBIS: 2Gb DDR3L SDRAM Automotive V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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