MT41K128M16JT-125 M AIT

Contact Sales

Orderable parts

MT41K128M16JT-125 M AIT:K

Specs

Chipset Validation

N/A
Data Rate

DDR3-1600
Density

2Gb
FBGA Code

D9QXX
Features

DDR3L-RS
Op. Temp.

-40C to +95C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x16

Technical Notes

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

File Type: PDF
Updated: 2023-06-30

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life

File Type: PDF
Updated: 2009-12-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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