MT41K128M16JT-107 IT

Orderable parts

MT41K128M16JT-107 IT:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    2Gb
  • FBGA Code
    D9RQN
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

2Gb: x4, x8, x16 DDR3L SDRAM

2Gb: x4, x8, x16 DDR3L SDRAM
  • File Type: PDF
  • Updated: 2018-09-21

2Gb: x4, x8, x16 DDR3 SDRAM

  • File Type: PDF
  • Updated: 2016-02-29

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2019

Simulation Models

HSpice: 2Gb DDR3L SDRAM V89C

2.1 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2012-05-01

IBIS: 2Gb DDR3L SDRAM V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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