MT41J64M16TW-093

Orderable parts

MT41J64M16TW-093:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-2133
  • Density
    1Gb
  • FBGA Code
    D9SFW
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR3 SDRAM

  • File Type: PDF
  • Updated: 2018-09-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 1/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 1/1/2020

Simulation Models

HSpice

2.3 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2016-09-12

IBIS

2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2014-09-15

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

User's Manual: New Features of DDR3 SDRAM

This manual is intended for users who design application systems using DDR3 SDRAM manufactured by Elpida.
  • File Type: PDF
  • Updated: 2014-02-26
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
See All
+