MT41J128M8JP-125

Orderable parts

MT41J128M8JP-125:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    1Gb
  • FBGA Code
    D9MNR
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

1Gb: x4, x8, x16 DDR3 SDRAM

  • File Type: PDF
  • Updated: 2018-09-20

Simulation Models

HSpice

2.1 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2011-07-08

IBIS

2.2 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2014-12-02

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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