MT41J128M8DA-093

Orderable parts

Specs

Simulation Models

IBIS

2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2014-09-15

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-ED-02: GDDR5X: The Next-Generation Graphics DRAM

This technical note compares GDDR5 and GDDR5X and discusses the evolution of GDDR5X.
  • File Type: PDF
  • Updated: 2016-05-31
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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