MT41J128M16JT-107G

Orderable parts

MT41J128M16JT-107G:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    gDDR3-1800
  • Density
    2Gb
  • FBGA Code
    D9PRS
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

2Gb: x4, x8, x16 DDR3 SDRAM

  • File Type: PDF
  • Updated: 2016-02-29

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2022

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2022

Simulation Models

HSpice: 2Gb DDR3 SDRAM V89C

Revision 2.0 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2012-02-03

IBIS: 2Gb DDR3 SDRAM V89C

Revision 2.2 (Die Rev. K)
  • File Type: ZIP
  • Updated: 2016-07-28

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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