MT47H512M4THN-3

Orderable parts

MT47H512M4THN-3:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-667
  • Density
    2Gb
  • FBGA Code
    D9LKQ
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-27

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2010-07-27

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01

IBIS

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01

2048Mb DDR2 Verilog model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18
See All

Customer Service Notes

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
+