MT47H256M8THN-3

Orderable parts

MT47H256M8THN-3:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-667
  • Density
    2Gb
  • FBGA Code
    D9MGC
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8

Data Sheets

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-27T05:00:00.0000000Z

1Gb: x4, x8, x16 DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-25T05:00:00.0000000Z

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30T05:00:00.0000000Z

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2010-07-27T00:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2019

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01T00:00:00.0000000Z

IBIS

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01T00:00:00.0000000Z

2048Mb DDR2 Verilog model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z

Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06T05:00:00.0000000Z
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