MT47H128M8SH-187E

Orderable parts

Specs

Data Sheets

1Gb: x4, x8, x16 DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-25

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

Simulation Models

HSpice: 1Gb DDR2 SDRAM

Rev. 2.0
  • File Type: ZIP
  • Updated: 2016-02-06

IBIS: 1Gb DDR2 SDRAM U88B

Rev. 2.2
  • File Type: ZIP
  • Updated: 2016-02-05

1024Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-01-10

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18
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Customer Service Notes

CSN-30: Lead Frame Package User Guidelines

Discusses Micron's lead-frame package options
  • File Type: PDF
  • Updated: 2011-05-27

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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