Orderable parts


Simulation Models


2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2011-01-12


2.3 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2019-09-03

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-46-14: Hardware Tips for Point-to-Point System Design

This technical note provides hardware tips for point-to-point system design including termination, layout, and routing.
  • File Type: PDF
  • Updated: 2008-06-30

TN-46-02: Decoupling Capacitor Calculation for a DDR Memory Channel

Provides a decoupling capacitor calculation for a DDR memory channel
  • File Type: PDF
  • Updated: 2004-12-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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