MT46V32M16CY-5B IT

Orderable parts

MT46V32M16CY-5B IT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR400B
  • Density
    512Mb
  • FBGA Code
    D9MKR
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

512Mb: x4, x8, x16 DDR SDRAM

  • File Type: PDF
  • Updated: 2011-07-28

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2022

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2022

Simulation Models

HSpice

2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2011-01-12

IBIS

2.3 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2019-09-03

Veriloq

  • File Type: ZIP
  • Updated: 2007-06-21

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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