MT46V16M16CV-5B

2.0 (Die Rev. M)

2.0 (Die Rev. M)

6

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note provides hardware tips for point-to-point system design including termination, layout, and routing.

Provides a decoupling capacitor calculation for a DDR memory channel

Explanation of Micron packaging labels and procedures.

Describes design considerations for bare die SiPs and MCMs.