MTA8ATF1G64AZ-2G3

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Orderable parts

MTA8ATF1G64AZ-2G3A1

MTA8ATF1G64AZ-2G3B1

Specs

Chipset Validation

N/A
Comp. Config

1Gb x 8
Data Rate

2400 MT/s
Density

8GB
FBGA Code

N/A
Product Longevity Program

No
Product Longevity Program Start Date

N/A
SPD Data

See SPD Data
Width

x64

Chipset Validation

N/A
Comp. Config

1Gb x 8
Data Rate

2400 MT/s
Density

8GB
FBGA Code

N/A
Product Longevity Program

No
Product Longevity Program Start Date

N/A
SPD Data

See SPD Data
Width

x64

Data Sheets

8GB (x64, SR) 288-Pin DDR4 UDIMM

MTA8ATF1G64AZ – 8GB

File Type: PDF
Updated: 2021-03-17

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Simulation Models

IBIS

B1

File Type: ZIP
Updated: 2016-06-13

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Technical Notes

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

File Type: PDF
Updated: 2023-06-30

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life

File Type: PDF
Updated: 2009-12-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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See All