MTA8ATF1G64AZ-2G3

Orderable parts

MTA8ATF1G64AZ-2G3A1
MTA8ATF1G64AZ-2G3B1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

8GB (x64, SR) 288-Pin DDR4 UDIMM

MTA8ATF1G64AZ – 8GB
  • File Type: PDF
  • Updated: 2019-03-01

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2020

Simulation Models

Spice

B1
  • File Type: ZIP
  • Updated: 2016-03-24

IBIS

B1
  • File Type: ZIP
  • Updated: 2016-06-13

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-09: Accelerate Design Cycles with Simulation Models

Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
  • File Type: PDF
  • Updated: 2010-02-09

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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