MT9KSF51272AZ-1G6

Orderable parts

MT9KSF51272AZ-1G6P1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x72

Data Sheets

2GB, 4GB (x72, ECC, SR) 240-Pin DDR3L UDIMM

Rev. G
  • File Type: PDF
  • Updated: 2015-08-17

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 10/1/2020

Simulation Models

HyperLynx

E1
  • File Type: ZIP
  • Updated: 2013-09-18

IBIS

E1
  • File Type: ZIP
  • Updated: 2014-03-18

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-09-08

CSN-37: Micron 95nm Legacy 256Mb and 512Mb DRAM Component Update

Describes certain legacy products.
  • File Type: PDF
  • Updated: 2015-01-09
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