MTA8ATF1G64HZ-2G3

Orderable parts

MTA8ATF1G64HZ-2G3A1
MTA8ATF1G64HZ-2G3B1

Specs

  • Chipset Validation
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

8GB (x64, SR) 260-Pin DDR4 SODIMM Data Sheet

MTA8ATF1G64HZ – 8GB
  • File Type: PDF
  • Updated: 2018-10-31

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 10/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 10/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 10/1/2020

Simulation Models

Spice

E2
  • File Type: ZIP
  • Updated: 2017-07-20

MTA8ATF1G64HZ-3G2E1_hyp

  • File Type: ZIP
  • Updated: 2020-02-14

IBIS

B1
  • File Type: ZIP
  • Updated: 2016-06-13

Technical Notes

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.
  • File Type: PDF
  • Updated: 2020-07-09

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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