MTA8ATF1G64HZ-2G3

Orderable parts

MTA8ATF1G64HZ-2G3A1
MTA8ATF1G64HZ-2G3B1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

8GB (x64, SR) 260-Pin DDR4 SODIMM Data Sheet

MTA8ATF1G64HZ – 8GB
  • File Type: PDF
  • Updated: 2021-03-17

Simulation Models

Spice

E2
  • File Type: ZIP
  • Updated: 2017-07-20

MTA8ATF1G64HZ-3G2E1_hyp

  • File Type: ZIP
  • Updated: 2020-02-14

IBIS

B1
  • File Type: ZIP
  • Updated: 2016-06-13

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-17: DDR2 SODIMM Optimized Address/Command Nets

This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.
  • File Type: PDF
  • Updated: 2005-05-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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