MTA8ATF1G64HZ-2G3

Orderable parts

MTA8ATF1G64HZ-2G3A1
MTA8ATF1G64HZ-2G3B1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 8
  • Data Rate
    2400 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

8GB (x64, SR) 260-Pin DDR4 SODIMM Data Sheet

MTA8ATF1G64HZ – 8GB
  • File Type: PDF
  • Updated: 2021-03-17

Simulation Models

Spice

E2
  • File Type: ZIP
  • Updated: 2017-07-20

MTA8ATF1G64HZ-3G2E1_hyp

  • File Type: ZIP
  • Updated: 2020-02-14

IBIS

B1
  • File Type: ZIP
  • Updated: 2016-06-13

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-47-17: DDR2 SODIMM Optimized Address/Command Nets

This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.
  • File Type: PDF
  • Updated: 2005-05-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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