MTA4ATF1G64HZ-3G2

Orderable parts

MTA4ATF1G64HZ-3G2E1
MTA4ATF1G64HZ-3G2E2
MTA4ATF1G64HZ-3G2F1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 16
  • Data Rate
    3200 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 16
  • Data Rate
    3200 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    1Gb x 16
  • Data Rate
    3200 MT/s
  • Density
    8GB
  • FBGA Code
    N/A
  • Part Status
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

260-Pin DDR4 SODIMM Core Data Sheet

  • File Type: PDF
  • Updated: 2020-07-31

8GB (x64, SR) 260-Pin DDR4 SODIMM

MTA4ATF1G64HZ – 8GB
  • File Type: PDF
  • Updated: 2021-09-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HyperLynx

E1
  • File Type: ZIP
  • Updated: 2021-05-14

SPICE

E1
  • File Type: ZIP
  • Updated: 2020-10-08

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-17: DDR2 SODIMM Optimized Address/Command Nets

This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.
  • File Type: PDF
  • Updated: 2005-05-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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