Data for Part Number MT8KTF51264HZ-1G6E1

SPD Data
Chipset Validation

SPD Data for Part Number MT8KTF51264HZ-1G6E1

Information is intended only for use on Micron manufactured modules. All information is provided "AS IS" and without warranties of any kind.

Byte Number Byte Description Byte Value
0 DDR3-CRC RANGE, EEPROM BYTES, BYTES USED 92
1 DDR3-SPD REVISON 13
2 DDR3-DRAM DEVICE TYPE 0B
3 DDR3-MODULE TYPE (FORM FACTOR) 03
4 DDR3-SDRAM DEVICE DENSITY BANKS 04
5 DDR3-SDRAM DEVICE ROW COLUMN COUNT 21
6 DDR3-MODULE NOMINAL VDD 02
7 DDR3-MODULE RANKS DEVICE DQ COUNT 01
8 DDR3-ECC TAG MODULE MEMORY BUS WIDTH 03
9 DDR3-FINE TIMEBASE DIVIDEND/DIVISOR 11
10 DDR3-MEDIUM TIMEBASE DIVIDEND 01
11 DDR3-MEDIUM TIMEBASE DIVISOR 08
12 DDR3-MIN SDRAM CYCLE TIME (TCKMIN) 0A
13 DDR3-BYTE 13 RESERVED 00
14 DDR3-CAS LATENCIES SUPPORTED (CL4 => CL11) FE
15 DDR3-CAS LATENCIES SUPPORTED (CL12 => CL18) 00
16 DDR3-MIN CAS LATENCY TIME (TAAMIN) 69
17 DDR3-MIN WRITE RECOVERY TIME (TWRMIN) 78
18 DDR3-MIN RAS# TO CAS# DELAY (TRCDMIN) 69
19 DDR3-MIN ROW ACTIVE TO ROW ACTIVE DELAY (TRRDMIN) 30
20 DDR3-MIN ROW PRECHARGE DELAY (TRPMIN) 69
21 DDR3-UPPER NIBBLE FOR TRAS TRC 11
22 DDR3-MIN ACTIVE TO PRECHARGE DELAY (TRASMIN) 18
23 DDR3-MIN ACTIVE TO ACTIVE/REFRESH DELAY (TRCMIN) 81
24 DDR3-MIN REFRESH RECOVERY DELAY (TRFCMIN) LSB 20
25 DDR3-MIN REFRESH RECOVERY DELAY (TRFCMIN) MSB 08
26 DDR3-MIN INTERNAL WRITE TO READ CMD DELAY (TWTRMIN) 3C
27 DDR3-MIN INTERNAL READ TO PRECHARGE CMD DELAY (TRTPMIN) 3C
28 DDR3-MIN FOUR ACTIVE WINDOW DELAY (TFAWMIN) MSB 00
29 DDR3-MIN FOUR ACTIVE WINDOW DELAY (TFAWMIN) LSB F0
30 DDR3-SDRAM DEVICE OUTPUT DRIVERS SUPPORTED 83
31 DDR3-SDRAM DEVICE THERMAL REFRESH OPTIONS 05
32 DDR3-MODULE THERMAL SENSOR 00
33 DDR3-SDRAM DEVICE TYPE 00
34 DDR3-FINE OFFSET FOR TCKMIN 00
35 DDR3-FINE OFFSET FOR TAAMIN 00
36 DDR3-FINE OFFSET FOR TRCDMIN 00
37 DDR3-FINE OFFSET FOR TRPMIN 00
38 DDR3-FINE OFFSET FOR TRCMIN 00
39 DDR3-BYTE 39 RESERVED 00
40 DDR3-BYTE 40 RESERVED 00
41 DDR3-PTRR TMAW MAC 84
42-59 DDR3-RESERVED BYTES 42-59 000000000000000000000000000000000000
60 DDR3-RC REV NOM MODULE HEIGHT 0F
61 DDR3-MODULE THICKNESS (MAX) 11
62 DDR3-REFERENCE RAW CARD ID 41
63 DDR3 - ADDRESS MAPPING/MODULE ATTRIBUTES 00
64 DDR3-HEATSPREADER SOLUTION 00
65 DDR3-REGISTER VENDOR ID (LSB) 00
66 DDR3-REGISTER VENDOR ID (MSB) 00
67 DDR3-REGISTER REVISON NUMBER 00
68 DDR3-REGISTER TYPE 00
69 DDR3-REG CTRL WORDS 1 AND ZERO 00
70 DDR3-REG CTRL WORDS 3 AND 2 00
71 DDR3-REG CTRL WORDS 5 AND 4 00
72 DDR3-REG CTRL WORDS 7 AND 6 00
73 DDR3-REG CTRL WORDS 9 AND 8 00
74 DDR3-REG CTRL WORDS 11 AND 10 00
75 DDR3-REG CTRL WORDS 13 AND 12 00
76 DDR3-REG CTRL WORDS 15 AND 14 00
77-116 DDR3-RESERVED BYTES 77-116 00000000000000000000000000000000000000000000000000000000000000000000000000000000
117 DDR3-MODULE MFR ID (LSB) 80
118 DDR3-MODULE MFR ID (MSB) 2C
119 DDR3-MODULE MFR LOCATION ID 00
120 DDR3-MODULE MFR YEAR 00
121 DDR3-MODULE MFR WEEK 00
122-125 DDR3-MODULE SERIAL NUMBER 00000000
126-127 DDR3-CRC E8C9
128-145 DDR3-MODULE PART NUMBER 8KTF51264HZ-1G6E1
146 DDR3-MODULE DIE REV 45
147 DDR3-MODULE PCB REV 31
148 DDR3-DRAM DEVICE MFR ID (LSB) 80
149 DDR3-DRAM DEVICE MFR (MSB) 2C
150-175 DDR3-MFR RESERVED BYTES 150-175 0000000000000000000000000000000000000000000000000000
176-255 DDR3-CUSTOMER RESERVED BYTES 176-255 FFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFF

Validated Chipset Data for Part Number MT8KTF51264HZ-1G6E1

Information is intended only for use on Micron manufactured modules. All information is provided "AS IS" and without warranties of any kind.

Manufacturer Chipset (System) Module Density
AMD Brazos FT1 4 GB
AMD Kabini FT3 4 GB
AMD Llano FS1 4 GB
AMD Richland FS1r2 4 GB
AMD Trinity FS1r2 4 GB
INTEL Broadwell 4 GB
INTEL Haswell 4 GB
INTEL Ivy Bridge 4 GB
INTEL Sandy Bridge 4 GB
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