MT8KTF51264HZ-1G6

Orderable parts

MT8KTF51264HZ-1G6E1
MT8KTF51264HZ-1G6N1
MT8KTF51264HZ-1G6P1

Specs

  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
    N/A
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

1GB, 2GB, 4GB (x64, SR) 204-Pin DDR3L SODIMM

Rev. K
  • File Type: PDF
  • Updated: 2021-05-25

Simulation Models

Hyperlynx

N1
  • File Type: ZIP
  • Updated: 2015-02-10

Hyperlynx

E1
  • File Type: ZIP
  • Updated: 2014-01-13

Hyperlynx

D1
  • File Type: ZIP
  • Updated: 2012-06-28

IBIS

E1
  • File Type: ZIP
  • Updated: 2014-04-04

IBIS

E1
  • File Type: ZIP
  • Updated: 2013-03-22

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-17: DDR2 SODIMM Optimized Address/Command Nets

This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.
  • File Type: PDF
  • Updated: 2005-05-16

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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