MT8KTF51264HZ-1G6

Orderable parts

MT8KTF51264HZ-1G6E1
MT8KTF51264HZ-1G6N1
MT8KTF51264HZ-1G6P1

Specs

  • Chipset Validation
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64
  • Chipset Validation
  • Comp. Config
    512 Meg x 8
  • Data Rate
    1600 MT/s
  • Density
    4GB
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • SPD Data
  • Width
    x64

Data Sheets

1GB, 2GB, 4GB (x64, SR) 204-Pin DDR3L SODIMM

Rev. K
  • File Type: PDF
  • Updated: 2015-07-21

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2019

Simulation Models

Hyperlynx

N1
  • File Type: ZIP
  • Updated: 2015-02-10

Hyperlynx

E1
  • File Type: ZIP
  • Updated: 2014-01-13

Hyperlynx

D1
  • File Type: ZIP
  • Updated: 2012-06-28

IBIS

E1
  • File Type: ZIP
  • Updated: 2014-04-04

IBIS

E1
  • File Type: ZIP
  • Updated: 2013-03-22

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-00-01: Moisture Sensitivity of Plastic Packages

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.
  • File Type: PDF
  • Updated: 2018-10-15

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
See All
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